FPC Flexible Circuit Board for Camera Module
L-shaped angle FPC for camera module, with black cover film, high-density gold finger pins on both ends and small SMT pads on board. Ultra-thin PI substrate features excellent bending performance and stable impedance. It transmits image signals between camera sensor chip and main board. SMT assembly available, customizable pin definition and dimensions. Fast prototyping, widely used in camera modules of mobile phones, tablets, wearable devices and surveillance equipment.
Product Attributes
- Customization Available
- Structure Double-Sided FPC
- Material Polyimide
- Model NO. Customized
- Combination Mode Without Adhesive Flexible Plate
